BGA PCB Assembly: Zero-Defect Soldering with 100% X-Ray Verification
Stop Gambling on Your High-Density Boards. Get Prototypes in 3-5 Days.
Why 85% of BGA Failures Happen (And How We Prevent Them)
BGA connections are hidden. Without the right equipment, you are flying blind. Most “low-cost” assemblers skip the critical steps, leading to Head-in-Pillow (HoP) defects, excessive voiding, and late-stage field failures.
We don’t just “solder” BGAs; we engineer the process to ensure 100% reliability for:
Medical Grade: Zero-tolerance for signal loss.
Industrial/Automotive: High-vibration resistance.
Telecommunications: Ultra-fine pitch (down to 0.35mm).
We handle what others turn away. Whether it’s a 0.4mm pitch processor or a massive 85x85mm FPGA, we deliver.
1. 100% Mandatory AXI (Automated X-Ray Inspection)
Every single BGA joint is inspected. We detect bridging, voids, and misalignment before the board leaves our facility.
We provide the X-ray images with your shipment. No extra charge.
2. Precision Thermal Profiling
We use 10-zone nitrogen reflow ovens to prevent oxidation. For complex boards, we use KIC thermal profiling to ensure the BGA balls reach the perfect liquidus temperature without damaging the substrate.
3. Specialized BGA Rework & Reballing
Got a bad batch from another vendor? Don’t scrap it. Our expert technicians can:
Remove and Replace single components without affecting neighbors.
Professional Reballing using high-quality spheres (Lead-free or Leaded).
Trace Repair under the BGA site.
The Numbers That Protect Your Cash Flow
|
Feature |
Our Standard |
Why It Matters To You |
|
Min Pitch |
0.35mm |
Supports the latest high-density chips. |
|
X-Ray Inspection |
100% Included |
No hidden field failure costs. |
|
Lead Time |
3-5 Days |
Beat your competitors to market. |
|
Placement Accuracy |
±0.025mm |
Perfect alignment for fine-pitch BGAs. |
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Instant Technical Review: Upload your BOM and Gerber files.
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DFM Feedback: Our engineers check your BGA pad design (NSMD/SMD) and via-in-pad specs for free.
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Production & Inspection: We assemble, X-ray, and ship via DHL/FedEx.
Frequently Asked Questions (FAQ)
Yes. For most industrial and medical applications, we adhere to IPC-A-610 Class 3. We ensure that any single void occupies less than 25% of the total solder ball area in the X-ray image. If your project requires a stricter limit (e.g., <10% for aerospace), we can optimize the reflow profile or use vacuum reflow to achieve it.
Absolutely. For BGAs with a pitch of 0.5mm or less, via-in-pad is common. We recommend resin plugging and copper capping (POFV) to prevent solder wicking, which causes “open joints.” Our DFM team will review your Gerber files for free to ensure your pad design is optimized for high-yield assembly.
Every rework job follows a strict thermal curve matching the original reflow profile. We use high-end Optical Alignment Rework Stations and perform mandatory Post-Rework X-Ray Inspection. We guarantee that the reworked component will have the same mechanical and electrical integrity as a new placement.
For ultra-fast 24-hour prototypes, we can use automated solder paste jet dispensing to bypass the stencil-making process, saving you 1-2 days and $150-$300 in costs. For batches over 5 units, we recommend laser-cut electro-polished stencils for maximum consistency.
We believe in transparency. Every batch comes with a Quality Release Folder, including:
High-resolution X-Ray Inspection Images.
Reflow Oven Thermal Profile data.
First Article Inspection (FAI) report.
AOI result summary.