High-Reliability PCB Assembly Services: A Precision-Driven Process
Quick Summary: From DFA analysis to 100% functional testing, we ensure your PCBA projects are delivered with zero defects.
Proactive Design for Assembly (DFA)
Stop errors before they reach the factory floor.
Our engineering team conducts a rigorous Gerber and BOM validation to identify risks early. We don’t just assemble; we optimize your design for mass production.
- Component Scrubbing: Cross-referencing footprints with your BOM to prevent costly orientation or sizing errors.
- Cost Efficiency: We suggest alternative parts for long-lead-time items to keep your cash flow moving.
Precision SMT Line (Surface Mount Technology)
Advanced automation for high-density designs (down to 01005 and 0.4mm pitch BGA).
- 3D SPI (Solder Paste Inspection)
70% of defects originate from poor soldering. We use 3D SPI to monitor solder volume, height, and area in real-time, ensuring IPC-A-610 Class 3 compliance from the very first step. - High-Speed Pick & Place
Our Siemens/Panasonic lines offer ±0.025mm accuracy. Whether it’s high-volume consumer electronics or complex medical prototypes, we ensure every component is placed with surgical precision. - Multi-Zone Reflow & Nitrogen Atmosphere
We utilize 10-zone reflow ovens with Oxygen-free Nitrogen (N2) to prevent oxidation, ensuring stronger, shinier solder joints and superior wetting.
Total Quality Assurance (TQA)
Visible quality you can trust：
- 3D AOI (Automated Optical Inspection): Detects missing parts, polarity, and lifted leads with AI-driven accuracy.
- X-Ray Inspection: Mandatory for BGAs and QFNs. We provide high-res X-ray images to prove internal joint integrity (voiding < 20%).
- Flying Probe Testing: Eliminate the cost of expensive fixtures. Ideal for fast-turn prototypes requiring 99.9% net coverage.
Specialized Through-Hole & Protection
- Selective Soldering: Precise, repeatable soldering for connectors and heavy components without heat-stressing nearby SMT parts.
- Aqueous Cleaning: Our multi-stage DI water system removes all flux residues to prevent long-term corrosion.
- Conformal Coating: We offer Acrylic, Silicone, and Urethane coatings for mission-critical applications (Automotive/Industrial).
5. Final Functional Testing (FCT)
We don’t ship “boards”; we ship working products. We offer custom test jig development to simulate real-world conditions, including power-on tests, signal validation, and burn-in.
Frequently Asked Questions (FAQ)
For prototypes (Quick-turn), we can deliver in 24–48 hours after components arrive. For mass production, typical lead times are 2–3 weeks. We prioritize speed without compromising IPC Class 2/3 standards to keep your project on schedule.
We offer both Turnkey (We source everything) and Consigned (You provide parts) options. We have a robust supply chain in China, sourcing from verified distributors like Mouser, Digikey, and Arrow to ensure 100% genuine parts and avoid counterfeit risks.
Every board with BGA/QFN undergoes mandatory X-ray inspection. We check for voids (strictly <25% per IPC), bridging, and “Head-in-Pillow” effects. We can provide these X-ray images as part of your quality report.
We have No MOQ. Whether you need 1 piece for a functional prototype or 10,000 pieces for market launch, we provide the same level of engineering support and DFA review.
Absolutely. We can build custom test fixtures based on your requirements. Our testing capabilities include IC programming, boundary scan, and full functional power-on tests to ensure a 100% pass rate upon arrival.